In semiconductor manufacturing, wafers are produced in batches, and each wafer contains hundreds or even thousands of individual chips. During the production process, defects can occur such as dust landing on the wafer, or misalignment during lithography. These defects can affect performance or yield of the chips. We will demo a process control task where we monitor defects on wafers.

Monitor the ongoing process and determine if it remains within the control limits or if further investigation is required

Monitor the ongoing process and determine if it remains within the control limits or if further investigation is required

We are checking if a given lithography process meets the target specification of 32.0 nm and then comparing the performance of two different lithography tools in terms of their mean gate CD output.

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